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Through-silicon-via (TSV) insertion for area optimization of SoC in foveros technology

621.382
NIV

D1838

Niveditha, M. Through-silicon-via (TSV) insertion for area optimization of SoC in foveros technology / by Niveditha, M.. - Silchar : NIT, 2023
viii, 41p. Guided by Brinda Bhowmick * Electronics & Communication Engineering * * Title

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