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Multichip module design,fabrication,and testing James J. Licari
Material type:
TextLanguage: English Series: Electronic packaging and interconnectionPublication details: New York McGraw_Hill c1995Description: xv, 381p. :illISBN: - 0-07-037715-4
- 621.381046 LIC
| Item type | Current library | Call number | Status | Date due | Barcode |
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National Institute of Technology, Silchar | 621.381046 LIC (Browse shelf(Opens below)) | Available | 44129 |
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| 621.381045 RAV Physics of optoelectronics | 621.381045 ROS Optoelectronics | 621.381046 GIN Multichip modules and related technologies: MCM, TAB and COB design | 621.381046 LIC Multichip module design,fabrication,and testing | 621.381046 STU Microwave and millimeter-wave electronic packaging | 621.381076 CAT 2000 solved problems in electronics | 621.381076 CAT 2000 solved problems in electronics |
Includes index
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