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1.
Multichip module design,fabrication,and testing James J. Licari by
  • Licari, James J
Series: Electronic packaging and interconnection
Material type: Text Text
Language: English
Publication details: New York McGraw_Hill c1995
Availability: Items available for loan: National Institute of Technology, Silchar (1)Call number: 621.381046 LIC.

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2.
Adhesives Technology for Electronic Applications by
  • Licari, James J
Material type: Computer file Computer file; Format: electronic
Language: English
Publication details: William Andrew
Availability: Items available for loan: National Institute of Technology, Silchar (1).

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